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Our client is a leading telecom solutions provider. Their products and solutions are being deployed in over 100 countries and now serve 45 of the world’s top 50 telecom operators, as well as one third of the world’s population. Our customer’s vision is to enrich people’s lives through communication. By leveraging their experience and expertise in the telecom sector, they help bridge the digital divide and give people the opportunity to join the information age, regardless of their geographic origin. Our client has more than 7000 employees in Europe out of which 600 highly qualified scientists and engineers work in the German Research Center for advanced R&D. Headquartered in Munich and Weilheim focuses on advanced technical research, architecture evolution design and strategic technical planning.

To further strengthen the team in Weilheim/Oberbayern. we are looking for an innovative and motivated:

Power Module Process Technology Expert (m/w/d)

Your focus will be on:

Actively support our client to ramp up its first Advanced Packaging Technology R&D Group in Europe as part of a Technology expert. You will set up the high power module technology capability and bring it to excellence. With your team you achieve our challenging targets in co-operation with internal expert groups as well as with 3rd parties like top universities, Fraunhofer Institutes or industry leaders. Your skill set and motivation will make the difference and ensure our client’s future advanced packaging technology excellence and competitiveness.

Within your role you support the management with:

  • Develop advanced joining processes (soldering, sintering, welding, wire bonding…, pending on your experience) for high power modules, mainly 600-1200 V
  • Develop advanced encapsulation process (molding) cleaning, adhesion promotion processes
  • Transfer such processes to other sites, scale to volume production
  • Prepare and manage R&D cooperation with external partners such as institutes or universities
  • Specify, select, buy, optimize equipment (tolerances) for prototyping and production
  • Build power module prototypes

These skills will help you to perform the role:

  • Master or PhD degree (or equivalent) in Physics, Electronics, Mechanical or Chemical Engineering or equivalent at University/ University of Applied Science
  • >10 years of experience in the power semiconductor industry, mainly in (IGBT, WBG) power module development

Working experience:

  • Expertise in high power module development or production
  • Familiar with high power module package process equipment
  • Familiar with automotive quality requirements (AEC, AQG 324), reliability methodology and analysis methods for electronic packages
  • Familiar with chip (IGBT, GaN, SiC, Si) package interaction, power module bill of materials, supplier landscape equipment, materials)
  • Good technical network in the fields of electronic packaging, high power electronics
  • Strong commitment to innovation, good in visualizing new ideas and concepts of Power Modules
  • Fluent in English; German or Chinese is a plus

If you are enthusiastic to shape the Next Generation of Power Modules in a Innovation Technologies Center being part of a multicultural team and growing environment, feel free to contact us. Driving future technologies with focus on customer satisfaction is one of our client’s mission. To apply for this position, please email your application in English to Alexandra Bräunlich:alexandra.braeunlich@adrian-roth.com Please feel free to contact Mrs. Bräunlich: 089-45220-133