Our client is an international semiconductor chip manufacturer. For the location in Dresden we are looking for a:

Senior Product Engineering Manager (m/w/d)


  • Ownership for product engineering team management in support our customer’s Automotive Industrial Group (AIG). The AIG business unit develops mixed signal IC’s and system level solutions for tier 1 automotive, medical and industrial applications.
  • Management of the Dresden AIG product engineering team
  • Responsibility for defining team strategy including budgeting, head-count, tools, annual operating plans and bench-mark assessments with peers
  • Full PE product lifecycle ownership from concept to end of life with a focus on ensuring the delivery of the highest quality products to our end customers
  • Definition of ATE test, qualification and manufacturing plans in collaboration with NPI teams
  • Product release into manufacturing with adherence and supporting documentation for AEC/PPAP
  • Data-sheet and automotive compliance reports
  • Product cost modelling and yield ownership
  • Product BOM release and maintenance
  • Excursion management for both suppliers and customers
  • KPI achievement in product releated deliverables including NPI execution and velocity, product cost, product quality performance and failure analysis cycle times
  • PAT, SYL, SBL, SPC limit and disposition optimizations to protect quality without excesive waste
  • AIG corporate representation for PE tools, work-flows, customer and supplier audits, NPI process definitions and enhancement, training
  • Establishment of team priorities, point of contact for escalations, able to solve problems with Minimal over-sight and the establishment of culture of collaboration and execution


  • BS or advanced degree in Electrical Engineering, MBA highly desired
  • Experience in automotive release procedures and direct interaction with automotive IC customers
  • Minimum 10 year experience in analog mixed signal product engineering NPI
  • Management of both on-site and remote product engineering teams
  • Fully proficient in PLM tools such as Agile, yield management tools such as PDF Exensio, SPC
  • Analog chip building blocks and test techniques, device physics, functional safety knowledge
  • In depth understanding of AEC/PPAP related procedures and proven track record of support tier 1 automotive customers through production release
  • Demonstrated track record of managing team budgets, tool deployments, annual strategy setting and collaboration with development teams during NPI
  • Ability to managing supplier excursions and customer escalations through problem solving, team representation, communication skills and ability to write and speak in English

Please send your application documents which best represents your skills and experience per email to: Adrian & Roth Personalberatung, 80796 München, sabine.voelkl[at]adrian-roth.com